Title:
SPUTTERING APPARATUS
Document Type and Number:
Japanese Patent JPH0593266
Kind Code:
A
Abstract:
PURPOSE: To reduce the amt. of a thin film peeled from the surface of a target cover of a sputtering apparatus.
CONSTITUTION: The edge parts of a target cover 8 holding a target 9 are provided with gradients, and Ar ions are made easy to bombard to the above edge parts, by which the adhesive force of the thin film deposited on the surface of the target cover 8 is strengthened.
Inventors:
IKUBO NARUHIRO
KOGA KAZUHIRO
KOGA KAZUHIRO
Application Number:
JP25116291A
Publication Date:
April 16, 1993
Filing Date:
September 30, 1991
Export Citation:
Assignee:
HITACHI LTD
HITACHI TOKYO ELECTRONICS
HITACHI VLSI ENG
HITACHI TOKYO ELECTRONICS
HITACHI VLSI ENG
International Classes:
C23C14/34; H01L21/203; H01L21/285; (IPC1-7): C23C14/34; H01L21/203; H01L21/285
Attorney, Agent or Firm:
Yamato Tsutsui