Title:
SPUTTERING DEVICE AND FILM PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP2018076558
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sputtering device capable of stably forming a film with desired thickness and quality for a long period, and a film production method.SOLUTION: In a sputtering device 100, an estimation part 201 estimates a deposition speed R1 corresponding to an intensity I of light received by a light receiving part 108 in a first period, and an estimation part 202 acquires output power Pof a power source and a flow rate Qof reactive gas, and estimates a deposition speed R2 in a second period longer than the first period by simulation. A correction part 203 corrects the deposition speed R1 estimated after a timing at which the deposition speed R2 is estimated and before a timing at which the deposition speed R2 is estimated in the next period, using the estimated deposition speed R2. A PID control part 204 controls a flow rate of the reactive gas and an output of the power source so that the corrected deposition speed R approaches to a target deposition speed R.SELECTED DRAWING: Figure 1
Inventors:
KUBO TOMOYA
HIROKI TAMAYO
HIROKI TAMAYO
Application Number:
JP2016219170A
Publication Date:
May 17, 2018
Filing Date:
November 09, 2016
Export Citation:
Assignee:
CANON KK
International Classes:
C23C14/54; C23C14/34
Attorney, Agent or Firm:
Kazuo Chikajima
Takashi Daejeon
Takashi Daejeon
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