Title:
スパッタ装置及びその制御方法
Document Type and Number:
Japanese Patent JP6580113
Kind Code:
B2
Abstract:
Provided is a sputtering apparatus capable of using the power of a driving source for rotating a target even in other applications, and a method for controlling the same. The magnetron sputtering-type sputtering apparatus capable of performing sputtering in the state of forming a magnetic field by a magnet between a target (110) and a substrate on which a thin film is deposited by the constituent atoms of the target (110) comprises: a motor (500); a rotary shaft (510) rotated by the motor (500); the target (110) rotated by transmitting the rotation power of the rotary shaft (510) by a first drive mechanism; and the magnet included in the inside of the target (110). A second drive mechanism for transmitting the rotation power of the rotary shaft (510) is separately provided from the first drive mechanism.
Inventors:
Keita Misawa
Satoshi Nakamura
Daisuke Aonuma
Watanabe Arata
Yamato Abe
Takami Takemi
Satoshi Nakamura
Daisuke Aonuma
Watanabe Arata
Yamato Abe
Takami Takemi
Application Number:
JP2017233492A
Publication Date:
September 25, 2019
Filing Date:
December 05, 2017
Export Citation:
Assignee:
Canon Tokki Co., Ltd.
International Classes:
C23C14/35; F16H19/02
Domestic Patent References:
| JP2008505250A | ||||
| JP2014058698A |
Attorney, Agent or Firm:
Takeshi Niwa
Takeshi Nakamura
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi
Takeshi Nakamura
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi