Title:
SPUTTERING DEVICE AND SPUTTRING METHOD
Document Type and Number:
Japanese Patent JPH08325725
Kind Code:
A
Abstract:
PURPOSE: To provide the sputtering device and sputtering method by which the thickness of a thin film formed on a substrate is precisely measured and a uniform thin film is formed on the substrate.
CONSTITUTION: A target 5 is sputtered to form a thin film on a substrate fixed to a rotating substrate holder 4. In this sputtering device, an opening is provided to the holder 4, and a film thickness sensor 7 is arranged at the rear of the holder 4 and opposed to the target 5 through the opening. A sensor using a quartz resonator is appropriately used as the sensor 7.
Inventors:
MURAKAMI AKIRA
Application Number:
JP12780195A
Publication Date:
December 10, 1996
Filing Date:
May 26, 1995
Export Citation:
Assignee:
SONY CORP
International Classes:
C23C14/34; C23C14/54; (IPC1-7): C23C14/34; C23C14/54
Attorney, Agent or Firm:
Akira Koike (2 outside)
Previous Patent: METHOD FOR SPUTTERING TARGET CONSISTING OF PLURAL COMPOSITIONS HAVING LARGE MELTING POINT DIFFERENCE
Next Patent: CATHODE
Next Patent: CATHODE