Title:
SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JP3166041
Kind Code:
B2
Abstract:
PURPOSE: To efficiently form a multilayer film with a small-sized and inexpensive device by fixing a substrate in the upper part of a vacuum chamber and successively arranging plural cathodes below the substrate so as to be movable in front of the substrate.
CONSTITUTION: A substrate electrode 5 fitted to a substrate 4 is fixed in the projecting segment 1a of a vacuum chamber 1 connected to an exhaust port 3. Plural cathodes 7 placed with targets 6 are arranged below. This vacuum chamber 1 is evacuated, then a sputtering gas such as Ar is introduced therein from a gas introducing port 2. Then, one cathode 7 is moved so a place opposite to the substrate 4 by a moving device 10 provided with an electric motor 9, and glow discharge is generated by a power source 11. Thus, the target 6 is sputtered to form a deposited film on the substrate 4. Then, the cathode 7 is changed and the other thin film is deposited on the deposited film to form a multilayer film. In such a manner, the device is miniaturized to improve the working efficiency and the sticking of dust to the target is suppressed to prevent the generation of abnormal discharge.
Inventors:
Osamu Takahashi
Toru Ii
Toshiharu Makisaka
Toru Ii
Toshiharu Makisaka
Application Number:
JP33878891A
Publication Date:
May 14, 2001
Filing Date:
December 20, 1991
Export Citation:
Assignee:
Showa Vacuum Co., Ltd.
International Classes:
C23C14/06; C23C14/34; C23C14/56; (IPC1-7): C23C14/34
Domestic Patent References:
| JP644472A | ||||
| JP6473075A |
Attorney, Agent or Firm:
Kinichi Kitamura (2 others)