Title:
SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JP3523962
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable production of a device having a high aspect ratio at a sufficient yield by eliminating unevenness in bottom coverage in holes appearing in a large number in a peripheral part of a substrate.
SOLUTION: In a vacuum container, a target 5 and a substrate 30 are coaxially arranged in parallel to face each other, and a thin film is deposited on the inner surface of a fine hole 301 formed on the surface of the substrate 30. The target 5 has a size such that Q1=N.Q2 and N is not smaller than 0.7, more preferably, not smaller than 0.7 and not greater than 1.2, the angle Q1 holding the relation of tanQ1=(Dt-Ds) /2L and the angle Q2 holding the relation of tanQ2=A/B, where A represents the diameter of the aperture of the fine hole 301, B represents its depth, Dt represents the size of the target 5, Ds represents the size of the substrate 30, and L represents the distance between the target 5 and the substrate 30.
Inventors:
Kobayashi, Masahiko
Application Number:
JP15004496A
Publication Date:
April 26, 2004
Filing Date:
May 21, 1996
Export Citation:
Assignee:
ANELVA CORP
International Classes:
C23C14/34; C23C14/04; C23C14/35; H01J37/34; H01L21/203; H01L21/285; H01L21/768; (IPC1-7): H01L21/285; C23C14/34; H01L21/203
Attorney, Agent or Firm:
保立 浩一
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