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Title:
SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JPH09143714
Kind Code:
A
Abstract:

To increase a sputtering speed by disposing a magnetic material consisting of a soft magnetic metal on the magnet of a cathode, thereby increasing the plasma density over the entire part of the surface of the target.

The cathode 8 has a backing plate 23 having a function as the cathode electrode to be connected to a power source, the target 21 adhered thereon and the magnet 22 arranged to face the target 21. The magnetic material 28 to concentrate the magnetic flux of the magnet 22 to a specified direction is disposed on the magnet 22. Magnetic materials consisting of soft magnetic metals having high magnetic permeability, for example, 'Permalloy (R)' and mild iron are used or this magnetic material 28. The magnetic material 28 is released concentrically to the surface of the target 21 and generates parallel magnetic fields over a wide range. Then, the sectional shape thereof is preferably a projecting shape from the viewpoint of converging the magnetic fluxes.


Inventors:
ABE ATSUHIRO
Application Number:
JP31142995A
Publication Date:
June 03, 1997
Filing Date:
November 29, 1995
Export Citation:
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Assignee:
SONY CORP
International Classes:
C23C14/35; C23C14/56; G11B5/85; G11B5/851; H01F41/18; (IPC1-7): C23C14/35; C23C14/56; G11B5/85; H01F41/18
Attorney, Agent or Firm:
Akira Koike (2 outside)



 
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