To provide a sputtering device capable of forming thin film uniform in film characteristics and the distribution of film thickness at a high speed, furthermore high in the utilizing efficiency of a target material and having a long service life.

A cylindrical target 12 composed of a thin film material is set on the center part in a vacuum tank, a cylindrical substrate holder 14 is coaxially arranged around the cylindrical target 12, and, on the cylindrical substrate holder 14, a substrate 16 is mounted opposite to the outer circumferential face of the cylindrical target 12. At the inside of the cylindrical target 12, a supporting cylinder 20 and an inclined cylindrical magnet 22 are coaxially arranged together, and the N magnetic pole face and S magnetic pole face of the inclined cylindrical magnet 22 are inclined to the center axis. By a rotary mechanism (not shown in figure), the inclined cylindrical magnet 22 is rotated around the center axis via the supporting cylinder 20.