PURPOSE: To provide a sputtering device provided with a target attaching mechanism without using a bonding agent and without spoiling a cooling effect by fixing a target material and a water-cooled packing plate by screwing via a thin metallic sheet.

CONSTITUTION: A rugged part facing a target 11 and a water-cooled packing plate 12 is provided in a sputtering device which deposits a metallic film or silicide film, etc. on a sample. An annular thin metallic film sheet 13 is mounted in the rugged part, and the target 11 is fixed to the plate 12 by means of a screw 14. A slight spacing 15 is provided to the rugged part, and a vent hole 16 is provided to the plate 12 to form an air vent. The workability in sputtering is improved by such target attaching mechanism and the effective utilizing rate of the target 11 is improved.