Title:
スパッタリング装置および成膜方法
Document Type and Number:
Japanese Patent JP4473342
Kind Code:
B1
Abstract:
The present invention provides a sputtering apparatus and a film forming method that can form a high quality film in a groove having a sloping wall such as a V-groove. The sputtering apparatus of the present invention includes a rotatable cathode (102), a rotatable stage (101), and a rotatable shield plate (105). The sputtering apparatus controls rotation of at least one of the cathode (102), the stage (101), and the shield plate (105) so that sputtering particles are incident on the V-groove formed in a substrate (104) at an angle of 50° or less with respect to a normal to a sloping wall of the V-groove.
Inventors:
Tetsuya Endo
Abara Ain Citaine Noel
Abara Ain Citaine Noel
Application Number:
JP2009525420A
Publication Date:
June 02, 2010
Filing Date:
December 24, 2008
Export Citation:
Assignee:
Canon ANELVA Corporation
International Classes:
C23C14/34
Attorney, Agent or Firm:
Masao Okabe
Okabe
Nobuaki Kato
Asahi Shinmitsu
Katsumi Miyama
Okabe
Nobuaki Kato
Asahi Shinmitsu
Katsumi Miyama