Title:
スパッタリング装置およびスパッタリング方法
Document Type and Number:
Japanese Patent JP7419114
Kind Code:
B2
Abstract:
To reduce a space required for a sputtering device, when performing such sputtering that an arrival range of sputtered particle on a substrate is restricted.SOLUTION: A shutter encloses a cathode around an axis, is provided rotatably around the axis, and is interposed between the cathode and a conveyance mechanism in a prescribed direction. When an opening is opened, and the conveyance mechanism conveys a substrate, the shutter is rotated in a rotation direction. The rotation direction is faced to a conveyance direction, as a view from the axis along a prescribed direction.SELECTED DRAWING: Figure 3
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Inventors:
Atsushi Ohsawa
Application Number:
JP2020040659A
Publication Date:
January 22, 2024
Filing Date:
March 10, 2020
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
C23C14/34; C23C14/35
Domestic Patent References:
| JP2019044216A | ||||
| JP2015137390A | ||||
| JP5065636A | ||||
| JP2016132806A |
Foreign References:
| US5108574 |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita