Title:
SPUTTERING METHOD
Document Type and Number:
Japanese Patent JPH0225566
Kind Code:
A
Abstract:
PURPOSE: To efficiently use a single target having a practically uniform compsn. and to efficiently form films having uniform quality by continuously arranging plural units each consisting of S pole and N pole enclosed with the S pole under the target.
CONSTITUTION: While film forming bodies 2 fitted to a carrier 1 are passed over a rectangular target 3 set over magnets 4, the target 3 is sputtered to form films on the surfaces of the bodies 2. Three units 4 each consisting of S pole 4-(1) and N pole 4-(2) enclosed with the S pole 4-(1) are used as the magnets 4. The formed films hardly undergo a change in thickness in the axial direction.
Inventors:
KUMANO KATSUFUMI
IZEKI SEIJI
KANAIZUKA TADAHITO
IZEKI SEIJI
KANAIZUKA TADAHITO
Application Number:
JP17554388A
Publication Date:
January 29, 1990
Filing Date:
July 14, 1988
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
C23C14/35; (IPC1-7): C23C14/35
Next Patent: DEVICE FOR UNIFORMLY HEATING LONG-SIZED SUBSTRATE