Title:
SPUTTERING SYSTEM
Document Type and Number:
Japanese Patent JP2009235497
Kind Code:
A
Abstract:
To inexpensively provide a sputtering system provided with magnet holders which easily uniformize the magnetic flux density in the surface of magnets without using a plurality of magnets.
The sputtering system includes: a plasma gun; a plasma formation chamber; a pair of magnets 11A, 11B; a pair of magnet holders 25A, 25B; a vacuum film deposition chamber; an electromagnetic coil; and a power source. The pair of magnet holders comprise: first constituting members 28A, 28B confronted with the effective main faces, respectively; and second constituting members 26A, 26B, 27A, 27B confronted with the parts other than the effective main faces, and the first constituting members 28A, 28B are composed of a magnetic material.
Inventors:
TERAKURA ATSUHIRO
IWASAKI YASUKUNI
AKASHI DAISUKE
MARUNAKA MASAO
MIYAZAKI NORIAKI
TSUCHIYA TAKAYUKI
NISHIDA ETSURO
IWASAKI YASUKUNI
AKASHI DAISUKE
MARUNAKA MASAO
MIYAZAKI NORIAKI
TSUCHIYA TAKAYUKI
NISHIDA ETSURO
Application Number:
JP2008083718A
Publication Date:
October 15, 2009
Filing Date:
March 27, 2008
Export Citation:
Assignee:
SHINMAYWA IND LTD
International Classes:
C23C14/46; C23C14/32; C23C14/34; C23C14/35; H01L21/285; H05H1/48
Domestic Patent References:
| JPH07296988A | 1995-11-10 | |||
| JPH0794451A | 1995-04-07 | |||
| JPH08213195A | 1996-08-20 | |||
| JPH1116893A | 1999-01-22 | |||
| JPH10195648A | 1998-07-28 | |||
| JP2008056990A | 2008-03-13 | |||
| JPH06349593A | 1994-12-22 |
Foreign References:
| WO2006082863A1 | 2006-08-10 |
Attorney, Agent or Firm:
Patent business corporation Yuko patent office