To prevent occurrence of irregular film deposition even when the substrate conveying speed is irregular, and to prevent a substrate with arc generated thereon from being a reject product.
The movement of a substrate (3) is detected by an encoder (6), and the sputter trigger signal (12) according to the movement of the substrate (3) is generated to execute the sputtering by the DC pulse power. When occurrence of arc is detected, the substrate (3) is stopped, and the sputtering is re-executed. As a result, the sputtering is executed synchronously with the movement of the substrate (3), and any irregular film deposition is not caused even when the conveying speed of the substrate (3) is irregular. Even when arc is generated, any immediate reject product of the substrate (3) can be avoided.
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TOMOTSUGI HEIJI
MASHITA TORU
