Title:
SPUTTERING TARGET, AND SPUTTERING APPARATUS
Document Type and Number:
Japanese Patent JP2017119898
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sputtering target and a sputtering apparatus capable of cooling the whole area of a target homogeneously.SOLUTION: A sputtering target 1 or a sputtering target 1 to be used for sputtering, comprises: the sputtering target 1 to be used in a sputtering and made of a material to be sputtered and having an inner circumference 1a formed of a material to be sputtered and having the shape of a portion of a conical surface; and a backing plate 2 formed of a cooling water passage 4, in which cooling water flows, for cooling the target 1 with a cooling water passage 4. In the target 1, the thickness corresponding to the distance between an inner circumference 1a or a target sputter face to be sputtered and a target cooling face 1b or the face on the side opposite to the inner circumference 1a and to be cooled by the cooling water passage 4 is homogeneous.SELECTED DRAWING: Figure 1
Inventors:
MORIMOTO YOSUKE
SUZUKI MASAYASU
SUZUKI MASAYASU
Application Number:
JP2015256704A
Publication Date:
July 06, 2017
Filing Date:
December 28, 2015
Export Citation:
Assignee:
SHIMADZU CORP
International Classes:
C23C14/34
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Masakazu Ito