スパッタリング用ターゲット及びその製造方法

Title:

スパッタリング用ターゲット及びその製造方法

Document Type and Number:

Japanese Patent JP4805284

Kind Code:

B2

More Like This:

JP7102606	Manufacturing method of aluminum alloy target, aluminum alloy wiring film, and aluminum alloy wiring film
JP2631022	PROBLEM TO BE SOLVED: To manufacture a photomagnetic recording medium
JP2012184158	LOW VALENCE TITANIUM OXIDE POWDER AND ZINC OXIDE-BASED SINTERED BODY

Inventors:

Saburo Wakita
Hiroya Ishizuka
Junichi Sasaki
Yuji Ishiwari

Application Number:

JP2008006283A

Publication Date:

November 02, 2011

Filing Date:

January 15, 2008

Export Citation:

Assignee:

Mitsubishi Materials Corporation
Mitsubishi Materials Electronic Chemicals Co., Ltd.

International Classes:

C23C14/34; C01B33/037

Domestic Patent References:

Attorney, Agent or Firm:

Masatake Shiga
Tadashi Takahashi
Yasuhiko Murayama
Noriko Yanai

Previous Patent: マイクロアレイ作製用基板の製造方法

Next Patent: 電子部品を検査し、且つ選別するためのシステム