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Title:
スパッタリングターゲット及びその製造方法
Document Type and Number:
Japanese Patent JP5122515
Kind Code:
B2
Abstract:
A sintered sputtering target having a structure where the average crystallize size is 1 nm to 50nm and preferably comprises an alloy having a three-component system or greater containing, as its primary component, at least one element selected from among Zr, Pd, Cu, Co, Fe, Ti, Mg, Sr, Y, Nb, Mo, Tc, Ru, Rh, Ag, Cd, In, Sn, Sb, Te and a rare earth metal. This target is manufactured by sintering atomized powder. Thereby provided is a high density target having an extremely fine and uniform structure manufactured with the sintering method, in place of a conventional bulk metal glass produced by the quenching of a molten metal, which has a coarse crystal structure and requires a high cost for its production.

Inventors:
Akihisa Inoue
Kimura Hisamichi
Kenichiro Sasamori
Masataka Yahagi
Atsushi Nakamura
Hideyuki Takahashi
Application Number:
JP2009118276A
Publication Date:
January 16, 2013
Filing Date:
May 15, 2009
Export Citation:
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Assignee:
jx Nippon Mining & Metals Co., Ltd.
International Classes:
C23C14/34; B22F9/08; C22C5/00; C22C9/00; C22C16/00; C22C19/07; C22C21/10; C22C33/02; C22C45/02; C22C45/10; C22F1/053
Domestic Patent References:
JP2002069550A
JP4351212B2
JP5017868A
JP62287070A
JP61124564A
Other References:
Z. PASZT, et al.,Preparation and characterisation of finemet amorphous magnetic thin films with enhanced Cu content,Thin Solid Films ,1998年,Vol.317,p.294-297
H. OKUMURA, et al.,Magnetic and structural characterization and ferromagnetic resonance study of thin film HITPERM soft magnetic materials for data storage applications,JOURNAL OF APPLIED PHYSICS,2003年 5月15日,VOLUME 93, NUMBER 10,p.6528-6530
M.V. SEDO, et al.,Post-processing and processing treatment and their effect on structure and properties of Finemet films,Journal of Non-Crystalline Solids,2001年 7月,Volume 287, Issues 1-3,p.104-109
Attorney, Agent or Firm:
Isamu Ogoshi



 
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