Title:
スパッタリングターゲット及びその製造方法
Document Type and Number:
Japanese Patent JP7097670
Kind Code:
B2
Abstract:
The purpose of the present invention is to reduce the occurrence of arcing during a production process, thereby improving the yield of the production process. This sputtering target is characterized by comprising a plurality of target members which are configured from a ceramic and are bonded to a base that is configured from a metal, with a bonding material being interposed therebetween, said bonding material being configured from a low-melting-point metal that has a melting point of 300°C or less. This sputtering target is also characterized in that: a surface of the base, with which the bonding material is in contact, has a surface roughness (Ra) of 1.8 μm or more; and each of the plurality of target members has a hollow cylindrical shape, while having a circular surface that faces an adjacent target member at a predetermined distance if the plurality of target members are bonded to the base so as to surround the outer circumferential surface of the base; and the circular surface has a surface roughness (Ra) of 1.0 μm or less.
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Inventors:
Kozo Nagata
Jun Kajiyama
Jun Kajiyama
Application Number:
JP2016574826A
Publication Date:
July 08, 2022
Filing Date:
February 10, 2016
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C23C14/34
Domestic Patent References:
| JP2008184640A | ||||
| JP200230431A | ||||
| JP2008523251A | ||||
| JP2004315931A |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners
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