Title:
SPUTTERING TARGET, MANUFACTURING METHOD OF SPUTTERING TARGET, AND OPTICAL FUNCTION FILM
Document Type and Number:
Japanese Patent JP2021193202
Kind Code:
A
Abstract:
To provide a sputtering target capable of efficiently and stably depositing an optical function film having an excellent heat resistance and an excellent alkaline resistance and being capable of sufficiently suppressing a light reflection from a metal thin film and the like, a manufacturing method of the same, and an optical function film.SOLUTION: A sputtering target contains one type or two types or more of a metal phase selected from Nb, W, and Ti and a zinc oxide phase, has a density ratio of 80% or more. A standard deviation of each content consisting of one type or two types or more of metal elements selected from Nb, W, and Ti, which is measured at multiple locations of a sputtering surface, is 5 mass% or less.SELECTED DRAWING: None
Inventors:
UMEMOTO KEITA
KANEKO DAISUKE
SUGIUCHI YUKIYA
OKANO SUSUMU
OTOMO KENJI
KANEKO DAISUKE
SUGIUCHI YUKIYA
OKANO SUSUMU
OTOMO KENJI
Application Number:
JP2020099577A
Publication Date:
December 23, 2021
Filing Date:
June 08, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C23C14/34; B22F1/00; B22F3/15; C04B35/453; C22C1/05; C22C14/00; C22C27/02; C22C27/04; C23C14/08; G02B1/113
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami