Title:
SPUTTERING TARGET MATERIAL, TARGET ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2023109139
Kind Code:
A
Abstract:
To provide: a sputtering target having a high bonding strength between a back plate ring, a front ring and the sputtering target; a target assembly; and a method for manufacturing the same.SOLUTION: A target assembly consists of: a sputtering target material having the side surface of a target body 1 having an annular projection 2 projected in the transverse direction, the front side of the target body 1 projected to the front side of the annular projection 2 and the rear side of the target body 1 projected to the rear surface of the annular projection 2; and a back plate ring 3 provided on the rear surface of the annular projection 2. A method for manufacturing the target assembly comprises steps of: welding the annular projection 2 to the back plate ring 3; and inserting a welding head 5 until it contacts or enters the annular projection 2 from a side close to the outside from the rear surface of the back plate ring 3 to gradually move the welding head 5 toward the inner peripheral surface of the back plate ring 3 in the welding step.SELECTED DRAWING: Figure 2
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Inventors:
OIWA KAZUHIKO
YAMADA HIROSHI
YAO KEKE
YAMADA HIROSHI
YAO KEKE
Application Number:
JP2022140622A
Publication Date:
August 07, 2023
Filing Date:
September 05, 2022
Export Citation:
Assignee:
ZHEJIANG SAXUM SEMICONDUCTOR TECH CO LTD
International Classes:
C23C14/34; B23K15/00; B23K20/12
Attorney, Agent or Firm:
Koji Tsubouchi