Title:
SPUTTERING TARGET
Document Type and Number:
Japanese Patent JP2003055763
Kind Code:
A
Abstract:
To provide a ceramic sputtering target by which cracking in a sintered body occurring during a manufacturing process (particularly bonding step) of the ceramic sputtering target and when attaching the target to a film deposition system and using it for sputtering can be reduced with higher certainty.
In the sputtering target containing a rectangular sintered body in which surface grinding is applied to a sputtering surface in a direction practically parallel to major axis, chamfering is applied to the edge parallel in the grinding direction, among the edges consisting of the sputtering surface and the edges of the sintered body.
Inventors:
HARA SHINICHI
UCHIUMI KENTARO
NAGASAKI YUICHI
KUROSAWA SATOSHI
UCHIUMI KENTARO
NAGASAKI YUICHI
KUROSAWA SATOSHI
Application Number:
JP2001247898A
Publication Date:
February 26, 2003
Filing Date:
August 17, 2001
Export Citation:
Assignee:
TOSOH CORP
International Classes:
C04B41/91; C23C14/34; (IPC1-7): C23C14/34; C04B41/91
Domestic Patent References:
| JPH1161395A | 1999-03-05 | |||
| JP2000345326A | 2000-12-12 | |||
| JP2001040469A | 2001-02-13 | |||
| JP2001026863A | 2001-01-30 | |||
| JP2001131736A | 2001-05-15 |