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Patent Searching and Data


Title:
スパッタリングターゲット
Document Type and Number:
Japanese Patent JP7009472
Kind Code:
B2
Abstract:
The present invention pertains to a sputtering target containing Y and Mg and having a composition represented by (1-x)Mg-xY (where, 0

Inventors:
Toshiaki Takeya
Application Number:
JP2019521980A
Publication Date:
January 25, 2022
Filing Date:
March 30, 2018
Export Citation:
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Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C23C14/34; C22C23/06; C22C28/00
Domestic Patent References:
JP2012122138A
JP2014026262A
Other References:
KRISTINA SCHLUTER,Corrosion performance and mechanical properties of sputter-deposited MgY and MgGd alloys,Corrosion Science,2014年,Vol.78,p.43-54
Y.YAMADA,Film thickness change of switchable mirrors using Mg-Y alloy thin films due to hydrogenation and deh,Solar Energy Materials & Solar Cells,2014年,Vol.126,p.237-240
Attorney, Agent or Firm:
Patent corporation ssinpat