To provide a stack assembly of a plurality of modules constituting electronic device or electro-mechanical device capable of responding to thickness fluctuation of at least one constitution element part in a plurality of assembled modules.

The invention is concerned with a stack assembly of a plurality of modules (32, 33 and 36) and a timepiece (1) provided with the assembly constituting a movement (3). Each module is attached to a plurality of attaching pins (24) via openings for assembling and assembled by compressing between a first plane (23) and a second plane (25). For absorbing the thickness (e) fluctuation of the first element part of the assembly, the assembly is provided with a plurality of stepped pipes (8) as pipe shape intermediate element parts attached to each attaching pin (24). Each stepped pipe (8) is inserted in openings (34a) for assembling the first element part.