Title:
積み重ね可能なモジュール
Document Type and Number:
Japanese Patent JP6778264
Kind Code:
B2
Abstract:
A stackable module has a housing provided to receive an electric/electronic component, and a clamping device for attachment to a support rail, wherein the clamping device has two latching/gripping hooks, which are displaceable in mutually opposite directions between an open position and a fastening position, and a force deflection mechanism for adjusting the latching/gripping hooks between the open position and the fastening position, said mechanism being actuable by means of an actuating element and able to be subjected to an actuating force from an outer side. In this case, the latching/gripping hooks bound a free opening distance which, for release fastening to the support rail, is greater in the open position and smaller in the fastening position than a provided support rail extent. In this case, provision is made for the force deflection mechanism to have an actuating-element-side deflection profile and a hook-side displacement part, which has a deformation portion which is deformable by a displacement force in order to generate a hook-side displacement, wherein between the deflection profile and the deformation portion, a sliding contact is able to be formed, at which the deformation portion is able to be subjected to the displacement force via the deflection profile.
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Inventors:
Sealer, ahim
Bayerbach, Jan
Heimsch, Jochen
Bayerbach, Jan
Heimsch, Jochen
Application Number:
JP2018529127A
Publication Date:
October 28, 2020
Filing Date:
November 28, 2016
Export Citation:
Assignee:
H & B ELECTRONIC GMBH & CO. KG
International Classes:
H02B1/052; H01H73/06
Domestic Patent References:
| JP63099645U |
Foreign References:
| WO2013054873A1 |
Attorney, Agent or Firm:
Hiroe Associates Patent Office