To provide the stacked coil device which can be manufactured through a filming process for a metal film composed of two layers, has a large electromagnetic coupling coefficient, and is reducible in manufacturing cost.

A 1st and a 2nd coil are divided into a square-shaped spiral lower-layer coil (shown by broken lines) and an upper-layer coil (shown by solid lines) across an insulating layer. The path of the 1st coil extends in the order to a lower-layer lead-out terminal 1e, a lower-layer lead-out line 1b, a lower-layer coil 1a, an upper-layer coil 1c, an upper-layer lead-out line 1d, and an upper-layer lead-out terminal 1f. The path of the 2nd coil extends in the order of an upper-layer lead-out electrode 2f, an upper-layer lead-out line 2d, a lower-layer coil 2a, an upper-layer coil 2c, a lower-layer lead-out line 2b, and a lower-layer lead-out terminal 2e. Then a single-coil part, where the coil of the lower layer and the coil of the upper layer do not face each other vertically, is arranged on one of the diagonals of a square spiral coil surface as shown by the dot-set part.