Title:
対象物を加熱及び冷却するためのステージ
Document Type and Number:
Japanese Patent JP7401279
Kind Code:
B2
Abstract:
[Problem] To provide a stage capable of uniformly heating (or cooling) a substrate. [Solution] This stage for heating and cooling an object is installed in a chamber 1 and comprises: a stage body 5, 6 that has a mounting surface on which the object is mounted; a heating unit 7 for heating the mounting surface; and a cooling unit 8 for cooling the mounting surface. The stage body 5, 6 also has a first groove 10 into which the heating unit is inserted and a second groove 10 into which the cooling unit is inserted. The gap between the first groove and the heating unit and the gap between the second groove and the cooling unit have a heat-conductive medium.
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Inventors:
Yuji Masuda
Application Number:
JP2019221514A
Publication Date:
December 19, 2023
Filing Date:
December 06, 2019
Export Citation:
Assignee:
Advantech Co., Ltd.
International Classes:
H01L21/683; C23C16/46; F26B23/00; H01L21/3065
Domestic Patent References:
| JP1050811A | ||||
| JP200743042A | ||||
| JP6260430A | ||||
| JP200021890A | ||||
| JP982786A | ||||
| JP201784523A | ||||
| JP200225913A |
Foreign References:
| KR1020100137795A |
Attorney, Agent or Firm:
Takayuki Hirose
Daisuke Seki
Daisuke Seki
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