PURPOSE: To eliminate a problem of an overhang and to obviate a step disconnection of a semiconductor layer to be laminated by extremely simple modifications of a structure and manufacturing steps.
CONSTITUTION: A source electrode 2S and a drain electrode 2D made of transparent conductive films opposed at a first gap at edges are formed on a transparent insulating board 1. Ohmic contact layers 3 set wider than the first gap are formed in the degree that a second gap to be generated at opposed edges do not cause step disconnection of a semiconductor layer 5 to be intruded into the second gap on the electrodes 2S and 2D to bury the first and second gaps in such a manner that both ends are laminated on both the layers 3 to form the layer 5 to operate as an active layer.
YANAI KENICHI
TANAKA TSUTOMU
