Title:
STAMP, TRANSFER METHOD USING STAMP, AND MEMS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2023107839
Kind Code:
A
Abstract:
To provide a stamp with small distortion of a transferred molding pattern, a transfer method using the stamp, and a MEMS manufacturing method.SOLUTION: A stamp has a resin molding formed on a substrate 2. The resin molding has a surface having a pattern, a side surface extending from the surface having the pattern toward the substrate 2, and a peripheral portion extending from the side surface to an outer edge of the substrate 2.SELECTED DRAWING: Figure 7
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Inventors:
KONDO YUKIKO
TANAKA SATORU
TANAKA SATORU
Application Number:
JP2023091977A
Publication Date:
August 03, 2023
Filing Date:
June 02, 2023
Export Citation:
Assignee:
SCIVAX KK
SHINETSU CHEMICAL CO
SHINETSU CHEMICAL CO
International Classes:
H01L21/027; B29C59/02
Attorney, Agent or Firm:
Ritsuji Okuda