Title:
蒸気生成ヒートポンプ装置
Document Type and Number:
Japanese Patent JP7143751
Kind Code:
B2
Abstract:
To uniformly distribute a mass flow rate of a refrigerant flowing in each condenser with a simple structure, even when a plurality of condensers is connected to one compressor in parallel.SOLUTION: A steam generating heat pump device includes: a heat pump portion 10 which has an evaporator 3 evaporating a low pressure refrigerant by heat collected from a heat source water HW, a compressor 1 compressing the low pressure refrigerant to a high pressure refrigerant, a plurality of condensers 2a and 2b connected in parallel which condense the high pressure refrigerant by exchanging heat with the heated water W, and a plurality of displacement type expanders 4a and 4b connected in parallel which decompresses and expands the high pressure refrigerant condensed by the condensers 2a and 2b to the low pressure refrigerant and supplies the low pressure refrigerant to the evaporator 3; a steam generating portion 20 which supplies the heated water W to each of the plurality of condensers 2a and 2b, and sends out steam generated by exchanging heat with the high pressure refrigerant to the outside; and a control portion C which controls the number of rotations of the plurality of displacement type expanders 4a and 4b. The control portion C controls the number of rotations of the displacement type expanders 4a and 4b so as to make a mass flow rate of the refrigerant to be introduced in the displacement type expanders 4a and 4b the same.SELECTED DRAWING: Figure 1
Inventors:
Yasuhiro Yokoyama
Kensetsu Yasushima
Yusuke Onishi
Kensetsu Yasushima
Yusuke Onishi
Application Number:
JP2018235294A
Publication Date:
September 29, 2022
Filing Date:
December 17, 2018
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
F22B3/00; F22B1/16; F25B6/02; F25B11/02; F25B27/02
Domestic Patent References:
| JP2018105596A | ||||
| JP2010185663A | ||||
| JP2008039237A | ||||
| JP2006138631A | ||||
| JP3099140A | ||||
| JP2016203677A | ||||
| JP2005003322A |
Foreign References:
| US20170241679 |
Attorney, Agent or Firm:
Sakai International Patent Office
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