Title:
STEAM SHIELDING ADHESIVE MATERIAL HAVING POLYMERIZED EPOXIDE SYRUP
Document Type and Number:
Japanese Patent JP2017020001
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To manufacture a pressure-sensitive shielding adhesive having especially high epoxide content (>50%) and extremely low halogen content, capable of being stored and used for encapsulating an organic electronics device.SOLUTION: There is provided a steam shielding adhesive containing an adhesive base consisting of at least one epoxide syrup, at least an elastomer, at least an initiator, optionally at least an adhesive resin, optically at least one other reactive resin and optically a solvent, where the adhesive base containing no solvent has steam permeation rate of less than 100 g/md, preferably less than 60 g/md, especially less than 30 g/md after activation of the reactive resin component and the epoxide syrup contains a bis-epoxide monomer and uncrosslinked polyepoxide with high molecular weight obtained therefrom.SELECTED DRAWING: Figure 3
Inventors:
CHRISTIAN SCHUH
KLAUS KEITE-TELGENBUESCHER
ANNALENA GRAUCOB
KLAUS KEITE-TELGENBUESCHER
ANNALENA GRAUCOB
Application Number:
JP2016111663A
Publication Date:
January 26, 2017
Filing Date:
June 03, 2016
Export Citation:
Assignee:
TESA SE
International Classes:
C09J163/00; C09J7/00; C09J11/06; C09J201/00
Attorney, Agent or Firm:
Mitsufumi Esaki
Blacksmith
Katsunori Uenishi
Ichiro Torayama
Blacksmith
Katsunori Uenishi
Ichiro Torayama