PURPOSE: To improve precision in printing by positioning a second stainless stencil whose open part is the same as that of a first stencil, with groove therein, and fixing those stencils.

CONSTITUTION: In a stencil structure to be used when a solder cream is to be printed on a surface mounting substrate 1, a groove 2 is formed by half etching at one side on a stencil surface excepting an open part 5 of a first stainless stencil. The stencil surface excepting the open part 5 and the groove 2 is coated with an adhesive, on which a second stainless stencil whose open part is the same as that of the open part 5 of the stencil is attached under pressure. The adhesive is cured, two stencils are fixed so as to make a stencil structure. By forming such a stencil structure, in surface mounting method with very minute surface mounting semiconductor element, change of composition of the solder cream with time, which affects the parting property of the solder cream, can be restrained.