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Title:
ステンシルワイパースポットクリーナー組立体および関連する方法
Document Type and Number:
Japanese Patent JP6487321
Kind Code:
B2
Abstract:
A stencil printer includes a stencil having a top surface and a bottom surface, a material applicator to apply material on the top surface of the stencil, and a stencil wiper assembly to clean the bottom surface of the stencil in a y-axis direction. The stencil wiper assembly has a wiper blade assembly configured to engage the bottom surface of the stencil and wipe the bottom surface of the stencil when moving the stencil wiper blade assembly along a stencil wiper gantry. The stencil wiper assembly further includes a spot cleaner assembly movably secured to the stencil wiper assembly. The spot cleaner assembly is configured to move in an x-axis direction and to spot clean the bottom of the stencil. A method for spot cleaning a stencil is further disclosed.

Inventors:
Joseph A. Perold
Robert Thiocca
Application Number:
JP2015520345A
Publication Date:
March 20, 2019
Filing Date:
June 23, 2013
Export Citation:
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Assignee:
Illinois Tours Works Inc.
International Classes:
B41F35/00; B08B1/00; B41F15/12
Domestic Patent References:
JP2003260781A
JP6122190A
Foreign References:
US20120145015
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Hirose Shigeki
Kentaro Ito