Title:
光造形用組成物
Document Type and Number:
Japanese Patent JP7075279
Kind Code:
B2
Abstract:
To provide a composition for light molding capable of increasing mechanical physical property of a molded article under a high temperature environment, and sufficiently decreasing viscosity during molding.SOLUTION: A composition for light molding contains a photocurable resin, an inorganic filler and an additive which is a compound having an amide bond and a C=C unsaturated double bond in a molecule. The additive may be selected from N-vinylformamide and 4-acrylo morpholine. The inorganic filler may be layered silicate compound such as talc, silica, mica. Under the high temperature environment of a molded article, storage elasticity modulus can be made at 2000 MPa or more and viscosity can be made at less than 2000 mPa s during molding.SELECTED DRAWING: None
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Inventors:
Kohei Uemoto
Kiichiro Ishida
Kazuki Kobashi
Kiichiro Ishida
Kazuki Kobashi
Application Number:
JP2018091857A
Publication Date:
May 25, 2022
Filing Date:
May 11, 2018
Export Citation:
Assignee:
Enplus Inc.
International Classes:
C08F2/48; B29C64/264; B33Y70/00; C08F2/44; C08F26/02; C08F26/06
Domestic Patent References:
| JP2001310918A | ||||
| JP2004238597A | ||||
| JP10030002A | ||||
| JP2017114701A | ||||
| JP2007262401A |
Foreign References:
| CN103755889A |
Attorney, Agent or Firm:
Onuki Kotake International Patent Office