Title:
STERILIZING BLISTER PACKAGING MOUNT AND BLISTER PACKAGE
Document Type and Number:
Japanese Patent JPH10323955
Kind Code:
A
Abstract:
To improve workability of laser perforating, and stabilize gas permeability by providing a pattern-like uncoated parts on an adhesive layer.
A blister packaging mount is composed of a composite sheet 16 formed by laminating thin paper 11 and a laminated film 13 with an adhesive layer 12, which has a pattern of uncoated parts 12a, in between. The laminated film 13 has a sealing layer to be heat-sealed to a blister, which is a sealed body, as one surface layer, and contains easy-peeling parts, which is separated with a lower strength than heat seal strength between the sealing layer and the blister. And the laminated film 13 is provided with many penetrating holes 14.
Inventors:
UCHIDA JUNICHI
FUJIKI JUN
FUJIKI JUN
Application Number:
JP13695797A
Publication Date:
December 08, 1998
Filing Date:
May 27, 1997
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B65D75/36; B32B7/06; B32B29/00; B65D75/60; (IPC1-7): B32B29/00; B32B7/06; B65D75/36; B65D75/60
Domestic Patent References:
JPH0356567U | 1991-05-30 | |||
JPS59174234U | 1984-11-21 | |||
JPH05220880A | 1993-08-31 | |||
JPH0471837A | 1992-03-06 | |||
JPH0429840A | 1992-01-31 |
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