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Title:
STICK OF ELECTRONIC PARTS ASSEMBLY AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH01279069
Kind Code:
A
Abstract:

PURPOSE: To increase a bending strength of a tape itself, by forming a continuously folded part along the longitudinal direction at the side edge of the tape itself sealed by a cover tape on a plurality of recesses to contain electronic parts.

CONSTITUTION: In a producing apparatus of a stick of electronic parts assembly, a cover tape 19 drawn from a tape reel 18 seals the openings of recesses 9 to contain the electronic parts 14 by a roller 40. After tape itself 5 sealed by the covering 19 is held by a heating element 21 in order to securely stick the cover tape 19 to the tape 5, a reinforcing folded part 23 being formed by a forming part 22, the tape being cut to a required length (e) by a cutter 24, and its is contained in a container 26 as a stick of electronic parts assembly 25. Thereby a continuously folded part along the longitudinal direction is formed at the side edge of a long size of tape and hence a stick of electronic parts assembly with an increased strength against bending of the tape can be supplied.


Inventors:
KATO EIJI
Application Number:
JP10144088A
Publication Date:
November 09, 1989
Filing Date:
April 26, 1988
Export Citation:
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Assignee:
SONY CORP
International Classes:
B65D85/86; B65B15/04; B65D73/02; B65D85/38; H05K13/02; (IPC1-7): B65B15/04; B65D73/02; B65D85/38; H05K13/02
Attorney, Agent or Firm:
Mitsuo Takahashi



 
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