Title:
STICKY ADHESIVE COMPOSITION, STICKY ADHESIVE SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2008247937
Kind Code:
A
Abstract:
To provide a sticky adhesive composition without developing the peeling off of a bonded boundary or package cracks in a package mounted with a thin semiconductor chip even being exposed under a severe reflow condition and capable of achieving a high package reliability.
This sticky adhesive composition is characterized by containing (A) an acrylic polymer, (B) an epoxy resin and (C) a compound having 2 phenolic hydroxy groups and 103 g/eq phenolic hydroxy equivalence.
Inventors:
Ichikawa, Isao
Saeki, Naoya
Shizuhata, Hironori
Saeki, Naoya
Shizuhata, Hironori
Application Number:
JP2007000087218
Publication Date:
October 16, 2008
Filing Date:
March 29, 2007
Export Citation:
Assignee:
LINTEC CORP
International Classes:
C09J133/00; C09J7/02; C09J11/06; C09J163/00; H01L21/52; H01L21/301
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