Title:
STIFFENER RING FOR REDUCING STRESS
Document Type and Number:
Japanese Patent JP3872458
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce a stress, in particular, generated in a material inside a laminate coupled to a circuit card by bending of the circuit card, as to electronic structure and a forming method related thereto.
SOLUTION: The laminate is coupled to an electron carrier by soldering. A stiffener is attached to one portion of a surface in the laminate by a stiffener adhesive using an adhesive, and the stiffener adhesive contacts physically with one portion of the first surface of the stiffener, and the portion of the surface in the laminate, by the adhesive. A thermal lid is attached to one portion of the second surface in the stiffener by a lid adhesive using the adhesive, and the lid adhesive contacts physically with one portion of a surface in the lid and one portion of the second surface of the stiffener. A void area is arranged between the surface in the thermal lid and the surface in the laminate.
Inventors:
David J. Alcoe
Kim J. Blackwell
Birendra Earl Jadahab
Kim J. Blackwell
Birendra Earl Jadahab
Application Number:
JP2003289426A
Publication Date:
January 24, 2007
Filing Date:
August 07, 2003
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
B42D15/10; H01L23/12; G06K19/077; H01L23/00; H01L23/10; H01L23/16; H01L23/36; H01L23/31; (IPC1-7): G06K19/077; H01L23/12; //B42D15/10
Domestic Patent References:
| JP11017064A | ||||
| JP9293808A | ||||
| JP11186438A | ||||
| JP10065040A | ||||
| JP11040687A | ||||
| JP9321085A | ||||
| JP9331002A |
Attorney, Agent or Firm:
Hiroshi Sakaguchi
Yoshihiro City
Takeshi Ueno
Yoshihiro City
Takeshi Ueno