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Patent Searching and Data


Title:
STIFFENING PLATE FOR PERFORATION PROCESSING FOR PRINTED BOARD OR THE LIKE
Document Type and Number:
Japanese Patent JP2004009193
Kind Code:
A
Abstract:

To provide a stiffening plate for perforation processing for a printed board which prevents generation of a cracking of a coating film by imparting appropriate hardness to a lubrication layer of a stiffening plate, prevents a blocking phenomenon in winding when manufacturing the stiffening plate, also prevents sticking in a handling of the stiffening plate at the time of perforation processing of the printed board or the like, and is provided with a lubrication layer with excellent stability of a coating film thickness.

A lubrication layer comprising a resin composition containing (A) 30-80 wt. prts. of polyethlene glycol having an average molecular weight of 1,000 or higher to less than 15,000, (B) 10-50 wt. prts. of polyethylene glycol having an average molecular weight of 15,000 or higher to less than 50,000 and (C) 5-40 wt. prts. of polyethylene glycol having an average molecular weight of 50,000-200,000 is formed on at least one surface of a stiffening plate base material of the stiffening plate for perforation processing for the printed board or the like. Trimethylolpropane is sometimes contained in the resin composition.


Inventors:
Kaburagi, Shingo
Uda, Norikazu
Takada, Susumu
Kita, Susumu
Application Number:
JP2002000164767
Publication Date:
January 15, 2004
Filing Date:
June 05, 2002
Export Citation:
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Assignee:
OTOMO KAGAKU SANGYO KK
SHOWA DENKO PACKAGING CO LTD
International Classes:
B23B49/00; H05K3/00; B23B49/00; H05K3/00; (IPC1-7): B23B49/00; H05K3/00