Title:
STONE MATERIAL CURVED SURFACE CUTTER
Document Type and Number:
Japanese Patent JP2587795
Kind Code:
B2
Abstract:
PURPOSE: To simply cut the curved surface of a stone material by horizontally moving a table with respect to a truck while raising and lowering an optical sensor corresponding to the rising and falling of a lift member by providing the optical sensor emitting a signal moving the table almost along the curved line part of the sheet like mold member held on the table.
CONSTITUTION: A sheet like mold member 51 is held on a table 49 and a signal moving the table almost along the curved line part of the mold member 51 is emitted from an optical sensor 47. The optical sensor 47 is raised and lowered in a predetermined ratio with respect to the rising and falling length of a lift member 23 by the signal of the optical sensor 47. The table 49 holding the mold member 51 is moved horizontally in a prdetermined ratio same to or different from the predetermined ratio with respect to the moving length of a truck 35 in a horizontal direction by the signal of the optical sensor 47. As a result, the curved surface of a stone material 90 is cut by a wire rope having a large number of cutting parts 32 containing a diamond powder so as to follow the shape of the mold member 51.
Inventors:
Shingo Owase
Application Number:
JP28137894A
Publication Date:
March 05, 1997
Filing Date:
October 20, 1994
Export Citation:
Assignee:
Shingo Owase
International Classes:
B23Q35/128; B24B27/06; B28D1/08; (IPC1-7): B28D1/08; B23Q35/128; B24B27/06
Domestic Patent References:
| JP58116121A | ||||
| JP6458472A | ||||
| JP1156014A |
Attorney, Agent or Firm:
Akicho Katsube