To prevent the positional displacement, crack, and chip of a semiconductor device, and damage to a bump electrode, and to facilitate the mounting of the semiconductor device on a wiring board by an inexpensive means.

The storage container has a plurality of recesses 5 for storing and transporting the semiconductor devices 3. The bottom surface of the recess 5 is coated with an adhesive 2 via a release agent 1 over an area at least larger than an arrangement area of the bump electrode of the semiconductor device 3 in thickness almost equal to the height of the bump electrode of the semiconductor device 3.