PURPOSE: To efficiently execute a connecting work of a strap wire by sucking and eliminating solder in a hole of a through-hole, inserting the strap wire into this hole and executing the soldering, at the time of mounting the loading parts onto a printed board.

CONSTITUTION: At the time of attaching horizontally a printed board 1 to an X-Y table 13 provided on the middle stage of a device body, and mounting the loading parts 2 to this printed board 1, since the printed board 1 is solder- dipped, solder adheres to and filled in a hole of a through-hole 3 for connecting a strap wire 5. Therefore, by moving the X-Y table 13, the through-hole 3 for inserting the strap wire 5 is positioned right above a solder sucking head 15, and by this head 15, the adhering solder is sucked and eliminated. Subsequently, by inserting the strap wire 5 into this through-hole 3, the X-Y table 13 is moved to right above a soldering head 16, and the through-hole 3 and a terminal of the strap wire are soldered. By repeating successively such operation, the strap wire 5 is connected to a desired part of the printed board 1.