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Title:
STRESS BUFFER BLANK MATERIAL AND PROTECTOR USING THIS MATERIAL
Document Type and Number:
Japanese Patent JPH04117974
Kind Code:
A
Abstract:

PURPOSE: To obtain the stress buffer blank material which is deformed softly against a slow stress variation, has a quality being high elasticity or near rigitidy against a quick stress variation, and has a self-shape holding property by mixing elastic minute and hollow spherical bodies into bouncing putty.

CONSTITUTION: A supporter 1 being a protector for which a stress buffer blank material is used is constituted by forming a buffer part 3 for executing a stress buffer operation in four lines in the longitudinal direction of the supporter as one example with respect to a base material 2 made of oblong cloth, and in the buffer part 3, that which is obtained by mixing elastic minute and hollow spherical bodies into bouncing putty being the stress buffer blank material 6 is sealed in. The bouncing putty is obtained by processing organopolysiloxane by a mixture of boron. The elastic minute and hollow spherical bodies are powder represented by Exvancel developed by Exvancel company in Sweden, and Matsumoto microsphere manufactured by Matsumoto fat pharmaceutical company.


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Inventors:
NAKANISHI MOTOYASU
OZAWA HIROSHIGE
Application Number:
JP23825390A
Publication Date:
April 17, 1992
Filing Date:
September 07, 1990
Export Citation:
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Assignee:
SUZUKI SOGYO KK
International Classes:
A63B71/08; C08J9/32; (IPC1-7): A63B71/08
Attorney, Agent or Firm:
Takahiko Higashiyama



 
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