Title:
応力・歪みの解析方法及び装置
Document Type and Number:
Japanese Patent JP4568883
Kind Code:
B2
Abstract:
Provided are a stress analysis method and stress analysis equipment that enable a detailed stress measurement, by using both a photoelasticity measurement method and a stress measurement (mechanoluminescence measurement) which utilizes a mechanoluminescent substance to measure a stress state of an object. Physical quantities that are measurable include individual principal stress component and a principal stress direction. The photoelasticity measurement method alone cannot measure individual principal stress component values.
Inventors:
Yukishi Hyodo
Xu super man
Takashi Yamane
Mikiyuki Akamatsu
Yoshiyuki Yokokawa
Tetsuya Kameyama
Xu super man
Takashi Yamane
Mikiyuki Akamatsu
Yoshiyuki Yokokawa
Tetsuya Kameyama
Application Number:
JP2006011844A
Publication Date:
October 27, 2010
Filing Date:
January 20, 2006
Export Citation:
Assignee:
National Institute of Advanced Industrial Science and Technology
International Classes:
G01L1/24; G01L1/00
Domestic Patent References:
| JP2001215157A | ||||
| JP2003139627A | ||||
| JP2002022559A |
Attorney, Agent or Firm:
Yusuke Hiraki
Toshiaki Watanabe
Toshiaki Watanabe