延伸性ＡＣＦ、その製造方法、これを含む界面接合部材及び素子 - POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION

Title:

延伸性ＡＣＦ、その製造方法、これを含む界面接合部材及び素子

Document Type and Number:

Japanese Patent JP2023553168

Kind Code:

A

Abstract:

本発明は延伸性ＡＣＦ、その製造方法、これを含む界面接合部材及び素子を提供する。

Inventors:

John, Eun Young
Kong, Min Sik
Hwang, Hye Jin

Application Number:

JP2023535659A

Publication Date:

December 20, 2023

Filing Date:

October 13, 2021

Export Citation:

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Assignee:

POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION

International Classes:

H01R11/01; C08K3/01; C08L51/04; C08L53/02; C09D115/00; H01B5/16; H01R43/00

Attorney, Agent or Firm:

HARAKENZO WORLD PATENT & TRADEMARK

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