Title:
STRIPPER AND STRIPPING METHOD FOR IC DEVICE
Document Type and Number:
Japanese Patent JP3690896
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus for stripping and removing an IC mounted on a board easily without causing damage to the board.
SOLUTION: When an IC device is stripped from a board, a tool is positioned directly above the IC device (#1) and then the tool is lowered down to a predetermined position (#2). The tool is then applied to the IC device mounted on the board through an adhesive, solder or paste and the IC device is stripped from the board by turning the tool (#3). Since the IC device can be stripped with a relatively small force, cracking of the IC device and damage on the board can be minimized.
Inventors:
Nishida alone
Application Number:
JP9780997A
Publication Date:
August 31, 2005
Filing Date:
April 16, 1997
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/04; H05K3/34; H05K13/00; (IPC1-7): H05K13/04
Domestic Patent References:
| JP5345290A | ||||
| JP4318947A | ||||
| JP4254345A | ||||
| JP55163853A | ||||
| JP63031573U |
Attorney, Agent or Firm:
Yoshihiro Morimoto
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