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Title:
剥離装置
Document Type and Number:
Japanese Patent JP5004114
Kind Code:
B2
Abstract:

To provide a peeling device capable of easily peeling a coating resin from a core material by surely forming a cut in a synthetic resin coating body for peeling the coating resin.

This peeling device P for peeling the coating resin 42 from the synthetic resin coating body 4 formed by covering the core material 41 with synthetic resin is provided with a tubular guide part 1 for inserting the synthetic resin coating body 4, a cutting blade 2 provided on an insertion passage inside the guide part 1, and a pushing part 3 provided facing the cutting blade 2; and is so constituted as to form the cut in the length direction of the coating resin 42 with the cutting blade 2 by moving the synthetic resin coating body 4 along the guide part 1 while pushing the synthetic resin coating body 4 toward the cutting blade 2 via the pushing part 3.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Hiroyuki Matsuoka
Shinichi Funase
Application Number:
JP2006115736A
Publication Date:
August 22, 2012
Filing Date:
April 19, 2006
Export Citation:
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Assignee:
Sekisui Resin Co., Ltd.
International Classes:
B26B27/00; B29B17/02
Domestic Patent References:
JP3068871U
JP49052089U
JP2002119779A
JP57118619U
JP2004337434A
JP2003164026A



 
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