Title:
STRUCTURE FOR FIXING ELECTRONIC DEVICE WITH LEAD WIRE TO BOARD
Document Type and Number:
Japanese Patent JP3220841
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a structure for fixing an electronic device having lead wires to a board in which the number of components is decreased and the assembling work is facilitated while reducing the cost and its thickness.
SOLUTION: The board fixing structure comprises a light emitting element 10 with lead wires 13 led out from both opposite sides of a light emitting element body 11, and a flexible board 40 provided with a land part 43 on the surface thereof. A spring piece 47 is formed by cutting a predetermined part in the vicinity of the land part 43 of flexible board 40 in substantially a tongue shape. An electronic device 10 with lead wires is mounted on the flexible board 40 and applied with a case 20. Under a state where the spring piece 47 is turned back to the rear side of land part 43, a protrusion 27 projecting from the lower surface of the case 20 and penetrating the flexible board 40 and the repellent piece 47 is caulked thermally, at the forward end thereof, on the underside of repellent piece 47 thus connecting the lead wire 13 and the land part 43 through elasticity.
Inventors:
Nobuyuki Kikuchi
Application Number:
JP24363095A
Publication Date:
October 22, 2001
Filing Date:
August 28, 1995
Export Citation:
Assignee:
Teikoku Communication Industry Co., Ltd.
International Classes:
H05K7/12; G09F9/33; H01L33/52; H05K1/18; H05K1/00; H05K3/30; H05K3/32; (IPC1-7): H05K1/18; H01L33/00; H05K7/12
Domestic Patent References:
| JP6318419A | ||||
| JP54111663U |
Attorney, Agent or Firm:
Takashi Kumagai (1 outside)