Title:
STRUCTURE HAVING SOLDER LAYER AND CONDUCTIVE COMPOSITION USED TO MAKE SAME
Document Type and Number:
Japanese Patent JP3431338
Kind Code:
B2
Abstract:
PURPOSE: To obtain a structure having a solder layer on the surface layer of a conductive composition and improved in wettability between the solder layer and the conductive composition and deflection strength by using a specified composition as the conductive composition.
CONSTITUTION: This structure is composed of a conductive composition mainly consisting of desirably 3-40wt.% binder component 2 comprising a resol phenolic resin having dimethylene ether bonds and a linear polymer resin (e.g. polyamide resin) and desirably 60-97wt.% metallic particle component 1 having a mean particle diameter of 0.1-50μm and a solder layer 4 which comes in direct contact with the metallic particle component 1. It is desirable that the metallic particle used is one in which the core is made of an Ni component and the surface of the core is coated with at least one noble metal selected from among Au, Ag, Pd and Pt.
Inventors:
Kazunori Menya
Mitsuru Harada
Takashi Obayashi
Wataru Sakurai
Takeshi Himori
Mitsuru Harada
Takashi Obayashi
Wataru Sakurai
Takeshi Himori
Application Number:
JP6925495A
Publication Date:
July 28, 2003
Filing Date:
March 28, 1995
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K1/09; C08K3/08; C08L61/04; C08L61/06; C08L77/00; C08L101/00; H01B5/14; H01B5/16; H05K3/24; (IPC1-7): C08L61/06; C08K3/08; C08L77/00; H01B5/14; H01B5/16; H05K1/09
Domestic Patent References:
| JP377202A | ||||
| JP321659A | ||||
| JP3176906A | ||||
| JP5914213A | ||||
| JP1265405A | ||||
| JP4345701A | ||||
| JP61185806A |
Attorney, Agent or Firm:
Hiroyuki Ikeuchi (1 person outside)
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