Title:
STRUCTURE OF INPUT SIDE TERMINAL ELECTRODE PORTION IN THERMAL HEAD
Document Type and Number:
Japanese Patent JP3575507
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To securely prevent jutting-out of a silver-palladium paste to the wiring pattern side beyond reinforcing layers by providing silver-palladium soldered layers shorter than the reinforcing layers so as to partially expose a part of the reinforcing layers adjacent to the wiring patterns.
SOLUTION: A length L2 of soldered layers 8 is provided shorter than a length L1 of reinforcing layers 7 by a length S so as to expose a part adjacent to a wiring pattern 5 of the reinforcing layers 7. According to the configuration, in the screen printing of a silver-palladium paste for forming the soldered layers 8, even if it is displaced with respect to the preliminarily formed reinforcing layers 7, jutting-out of the silver-palladium paste to the wiring patterns 5 side beyond the reinforcing layers 7 can be securely prevented. A projecting portion 8a is integrally provided to the soldered layer 8 on the outermost side.
Inventors:
Yutaka Yoshida
Application Number:
JP6583796A
Publication Date:
October 13, 2004
Filing Date:
March 22, 1996
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
B41J2/345; H05K3/24; (IPC1-7): B41J2/345; H01R12/32; H05K3/24
Domestic Patent References:
| JP5218623A |
Attorney, Agent or Firm:
Akio Ishii
Tadashi Higashino
Hiroyuki Nishi
Tadashi Higashino
Hiroyuki Nishi
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