Title:
STRUCTURE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2022177539
Kind Code:
A
Abstract:
To provide a structure which is excellent in heat exchange efficiency of a heat-exchanged body, and to provide a manufacturing method of the structure.SOLUTION: A structure includes: a housing having a through hole or a non-through hole in a thickness direction; a heat exchanger embedded in the through hole or the non-through hole of the housing; and at least one heat-exchanged body which is provided contacting with the heat exchanger. The heat exchanger includes a hollow outer packaging material provided with a heat medium inflow port and a heat medium outflow port, and has a first major surface, a second major surface facing the first major surface, and a connection portion of the first major surface and the second major surface which are formed by the outer packaging material. The at least one heat-exchanged body is provided in contact with at least one of the first major surface and the second major surface of the heat exchanger. The heat exchanger has a maximum thickness larger than a depth of the through hole or the non-through hole in which the heat exchanger is embedded when the heat-exchanged body is removed and a heat medium flows into its interior.SELECTED DRAWING: Figure 7
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Inventors:
ITO SEIICHI
YAMASHITA TAKAHIRO
SHODA HIROAKI
FUKUKAWA YUJI
YAMASHITA TAKAHIRO
SHODA HIROAKI
FUKUKAWA YUJI
Application Number:
JP2021083878A
Publication Date:
December 01, 2022
Filing Date:
May 18, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
F28F21/06; F28F3/12; H05K7/20
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office